发明名称 Fine pitch bonding technique
摘要 A capillary for bonding a wire between two bonding locations which comprises a capillary (1) having a body having an exterior surface, a bore (23) therethrough and a wall disposed between and defined by the bore and the exterior surface, the bore terminating at an end portion (9) of said body. The wall has at one end portion thereof first (21) and second opposing sectors spaced from each other by third and fourth opposing sectors (31), the first sector having a thickness greater than the rest of the sectors and the second sector having a thickness intermediate the first sector and the third and fourth sectors. A first bond, generally a ball bond (3), is formed at a first bonding location with the capillary. The capillary is moved to a second bonding location and a stitch bond is formed at the second location while the portion of the capillary of greater thickness is downstream of the path of travel of the capillary while making the stitch bond.
申请公布号 US5954260(A) 申请公布日期 1999.09.21
申请号 US19970991129 申请日期 1997.12.16
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 ORCUTT, JOHN W.
分类号 H01L21/60;B23K20/00;H01L21/603;H01L21/607;(IPC1-7):B23K1/06;B23K37/00;B23K3/02 主分类号 H01L21/60
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