| 摘要 |
FIELD: mass production of printed-circuit boards for radio electronics and other industries. SUBSTANCE: method involves drilling holes in insulating blank, preparing surfaces, simultaneously evaporating copper onto insulating base and on walls of holes until desired thickness is obtained by disintegrating vapors of copper carbonyl chloride CuCoCl, shaping photoresist pattern of printed-circuit board, removing photoresist, and etching metal layer at problem points. EFFECT: improved quality and reliability of printed-circuit boards, facilitated manufacture, and reduced cost.
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