发明名称 |
PASSIVE COMPONENT INTEGRATED CIRCUIT CHIP |
摘要 |
A passive component integrated circuit chip formed on an insulative substrate includes a first conductive metallic layer on a major surface of the substrate; a layer of dielectric material on top of the first conductive metallic layer; a second conductive metallic layer on top of the formation of dielectric material; a layer of insulative material on top of the layer of dielectric material and on and around the second conductive metallic layer, but not completely covering the second conductive metallic layer; a conductive via in contact with a portion of the second conductive metallic layer left uncovered by the layer of insulative material; a resistive layer on top of the layer of insulative material and in contact with the conductive via; a conductive contact in contact with the resistive layer; and a passivation layer on top of the resistive layer so as to provide a seal between the resistive layer and the conductive contact. Conductive end terminations are advantageously formed on the ends of the substrate to terminate selected conductive contacts and/or conductive metallic layers.
|
申请公布号 |
WO9941832(A1) |
申请公布日期 |
1999.08.19 |
申请号 |
WO1999US02840 |
申请日期 |
1999.02.05 |
申请人 |
BOURNS, INC. |
发明人 |
CHASE, JOHN, R.;JEPPESEN, BRUCE, LEON |
分类号 |
H01G4/40;H01L27/06;H03H1/02;H03H7/06;(IPC1-7):H03H1/02 |
主分类号 |
H01G4/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|