| 摘要 |
The invention concerns a wire sawing device comprising at least a support table (35) bearing a piece to be sawed (34) urged against the set of wires layer (26, 27) two outer wire-guide rolls (10, 11) powered by motors (14, 15) and at least two inner wire-guide rolls (16, 17). The wire (18) is wound on the wire-guide rolls so as to constitute between the inner wire-guide rolls (16, 17) two cross sets of wires (26, 27) whereof the projecting wires are parallel and at a distance from a first space (31) and so as to be returned by the outer wire-guide rolls (10, 11) whereon is provided a second space (30) twice the first space (31). Such an arrangement enables a balanced distribution of forces on the inner wire-guides (16, 17), the surfaces of the sawed slices to be perfectly parallel, the shearing forces on the piece to be sawed (34) to be reduced, a decrease in the cutting pressure, a greater cutting speed and to improve the precision of the resulting slices. |
