| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a device and method for cutting a semiconductor wafer in a simple operation for maintaining high vacuum, and for realizing highly accurate cleavage. SOLUTION: A cutting device is provided with interposing members 11 and 12 for interposing the both edge part sides of a semiconductor wafer W from the scheduled cut surface, bearings 15 and 16 for supporting the interposing members 11 and 12 so that angular displacement can be attained freely around axes separated in a prescribed distance at both sides from the scheduled cut surfaces, and electromagnetic holder 20 for positioning the interposing members 11 and 12 in a state such that the semiconductor wafer W is interposed. The interposing members 11 and 12 are released by the electromagnetic holder 20 and bending moment due to the own weight of the interposing members 11 and 12 which acts on the wafer W, so that the wafer W can be cleaved on the scheduled cut surface.</p> |
