| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package whose hygroscopicity and reliability is improved, and a method for manufacturing this. SOLUTION: This is a semiconductor package in which a solder resist 3 with proper thickness is provided among conductor circuits 2, 4, and 5 on the surface of a substrate, and a method for manufacturing the semiconductor package including a process for operating patterning while allowing the solder resist 3 to remain among the conductor circuits 2, 4, and 5 by removing the solder resist by radar irradiation. |
