| 摘要 |
PROBLEM TO BE SOLVED: To reduce warp due to contraction of a prepreg by providing a multilayer printed wiring board and a prepreg, respectively, with a part for suppressing orthogonal anisotropic shift of the board and the prepreg inserted between the boards from the axis of the board at the time of hot press. SOLUTION: A structure comprising a printed board 1 having orthogonal anisotropy and a prepreg 2 inserted between the boards is positioned. The printed board 1 and the prepreg 2 are provided, respectively, with a part 13 for suppressing orthogonal anisotropic shift of the board 1 and the prepreg 2 from the axis at the time of hot press. The suppressing part 13 is a pin hole 4 located between positioning reference pins 3 for hot press lamination in the vicinity of the intermediate part thereof and both of the board 1 and the prepreg 2 suppress shift in the center of the side. Consequently, warp is reduced by suppressing contraction of the prepreg thus facilitating insertion/draw out of a connector, or the like, into/from a muitilayer printed wiring board. |
