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发明名称
摘要
The present invention provides a method of forming a fluidtight electrical conduit through a high aspect ratio hole, the method comprising sintering a via ink to form the electrical conduit and to seal the hole.
申请公布号
JPH11506183(A)
申请公布日期
1999.06.02
申请号
JP19970500408
申请日期
1995.11.09
申请人
发明人
分类号
C04B38/06;B01F5/06;B01F13/00;B01J4/02;B01J19/00;B01L3/00;B81B3/00;B81C1/00;C40B40/06;C40B60/14;F04B19/00;F04F99/00;H02N11/00;(IPC1-7):F04F11/00
主分类号
C04B38/06
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代理人
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