PACKAGE FOR SEMICONDUCTOR AND MANUFACTURE OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a structure for the package of a semiconductor for adopting the miniaturization and simple mounting method of the package, and a method for manufacturing it. SOLUTION: An insulating layer 3 which can be plated on a part except the head of a first bump and a prescribed conductive wiring pattern formed by an end batch processing is formed on a wafer-shaped semiconductor substrate 1, and a second bump 7 is provided as an outside connecting terminal at the electrode part of a plated wiring conductor 5, formed continuously at the head of the first bump so that facedown solder reflow mounting on a wiring substrate can be attained.