Chip bead element and manufacturing method thereof

摘要

The present invention relates to a laminated chip bead element demonstrating noise absorption characteristics over a broad range in a high frequency range of GHz or higher. An insulating body (1) is constituted of a material achieved by mixing ferrite powder and an insulating resin. At least one signal conductor (2) is embedded in the insulating body (1). It is desirable that the insulating body (1) includes a plurality of composite members (11, 12).