| 摘要 |
PROBLEM TO BE SOLVED: To make a reliable resin molding possible without leaving unnecessary resin on a substrate. SOLUTION: In a resin molding process, for a substrate used for a semiconductor device provided with a metal part 8 for peeling off the hardened resin after resin molding at the position to be arranged a resin passage 7 for resin filling on the substrate 10a, the surface of the metal part 8 is covered by the resin coating 9b having higher close contact performance than that with the metal part, so that the resin passage 7 is formed to pass within the width of the metal part 8. |
