发明名称
摘要 PROBLEM TO BE SOLVED: To provide a wafer holding plate on which a marking which can be surely detected by a sensor and which has no affect on products, is placed. SOLUTION: A marking M is placed on the joint surface side of a circular template 2 stuck on a circular plate 1 made of a hard and brittle material, or a circular plate 1, and the circular template 2 is made of transparent or semitransparent resin template so that it can be detected by a photosensor. Thus, the marking M part is sandwiched between the hard and brittle plate 1 and the template 2 not to be exposed to the front surface on the side of the surface to be polished.
申请公布号 JP2888339(B1) 申请公布日期 1999.05.10
申请号 JP19980081623 申请日期 1998.03.27
申请人 发明人
分类号 B24B37/04;B24B37/30;B28D7/04;H01L21/304 主分类号 B24B37/04
代理机构 代理人
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