发明名称 HIGH FREQUENCY BI-LEVEL OFFSET MULTI-PORT JACK
摘要 <p>A multi-port modular jack (10) including an outer housing part (100) having a top wall (110), a bottom wall (115) and a front face (105) having a mid-portion (107) arranged substantially parallel to and between the top wall (110) and the bottom wall (115). The front face (105) defines a first, upper row of at least one aperture (200) between the mid-portion (107) and the top wall (110) and a second, lower row of at least one aperture (210) between the mid-portion (107) and the bottom wall (115). The aperture (200) in the first row has a plane of symmetry offset in relation to a plane of symmetry of the aperture (210) in the second row such that only a portion of the aperture (200) in the first row is directly opposed to the aperture (210) in the second row. Inner housing parts (1000, 1100) are arranged in the outer part (100) to define a plug-receiving receptacle therewith in alignment with a respective aperture (200, 210) in the front face (105) of the outer housing part (100). Each inner housing part (1000, 1100) includes contact/terminal members (1010, 1110) for engaging contacts of a plug insertable into a respective plug-receiving receptacle. A vent (164) is formed in the outer housing part (100) to allow for air flow through the jack (10). A metallic shield (1200) may surround the jack (10).</p>
申请公布号 WO1999019944(A1) 申请公布日期 1999.04.22
申请号 US1998021412 申请日期 1998.10.09
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