Semiconductor package and method for manufacturing the same

摘要

A thermal conductive sheet 31 including at least 70-95 weight parts of inorganic filler and 5-30 weight parts of thermosetting resin composition and having flexibility in an uncured state is prepared. Through-holes 33 are formed in the thermal conductive sheet 31 and a conductive resin composition 34 is filled in the through-holes 33. The thermal conductive sheet 31 and a semiconductor chip 35 are overlapped to match positions of the through-holes 33 formed in the thermal conductive sheet 31 with those of the electrodes formed on the semiconductor chip 35. The thermal conductive sheet 31 and the semiconductor chip 35 are compressed while being heated and the thermal conductive sheet 31 is cured and integrated with the semiconductor chip 35. An external lead electrode 36 is formed on the thermal conductive sheet 31 at a side opposite to the surface where the semiconductor chip 35 is overlapped, and that is connected with the conductive resin composition 34. According to the above-mentioned configuration, a semiconductor package that is not required to be sealed by resin, and is excellent in reliability, air-tightness and thermal conductivity can be realized.