| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce a shift in position between a flip chip and a lead frame and to prevent failures in contact between the lead frame and a bump by sticking a stick-up pin upward into a tapered positioning hole of the lead frame and also by pressure-fitting the flip chip to the lead frame. SOLUTION: A stick-up pin 4 mechanically positioned with respect to a pyramid collet 2 is passed through a through hole 9a of a heater plate 9 and stuck up into a tapered positioning hole 1a of a lead frame 1 so that a tip 4a of the pin 4 is tightly fitted into the tapered positioning hole 1a of the lead frame 1. If a very small shift in position of thickness of the lead frame or less occurs between a flip chip 3 sucked to the pyramid collet 2 and the lead frame 1, the stick-up pin 4 is stuck up, thereby displacing the lead frame 1 laterally to allow the very small shift in position of the lead frame 1 with respect to the pyramid collet 2 to be corrected.</p> |
