发明名称 |
Apparatus for conditioning polishing pads |
摘要 |
A flexible conditioning apparatus and method for uniformly conditioning a polishing surface of a pad used to remove undesirable irregularities from a silicon wafer and to achieve a planar condition of the polishing pad. In a preferred embodiment of the present invention, a roughening member comprising a plurality of point contacts, such as diamond particles, is adapted for movement into and out of engagement with the surface of the pad. A flexible member supporting the roughening member allows the roughening member to conform to the surface of the pad to achieve uniform polishing of the pad.
|
申请公布号 |
US5885147(A) |
申请公布日期 |
1999.03.23 |
申请号 |
US19970854862 |
申请日期 |
1997.05.12 |
申请人 |
INTEGRATED PROCESS EQUIPMENT CORP. |
发明人 |
KREAGER, DOUGLAS P.;LEE, JUNEDONG |
分类号 |
B24B37/00;B24B37/04;B24B53/007;(IPC1-7):B24B29/00 |
主分类号 |
B24B37/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|