发明名称 |
METHOD FOR PRODUCING COPPER-CLAD LAMINATED BOARD |
摘要 |
Disclosed is a method of producing a copper-clad laminated board comprising the steps of laminating a glass epoxy prepreg between both-side roughened copper foils, holding the upper and bottom copper foils with a polyamide-type films having a melting point of 170 DEG C or higher, and heating and press-molding the resultant structure while holding the top and bottom of the structure with press plates. The use of a polyamide-type film as a mold releasing film prevents the film from being stuck at all on the both-side roughened copper foil or the press plates, yielding a high separation property, and can maintain the shapes of the ruggedness on the roughened surface. |
申请公布号 |
KR0172456(B1) |
申请公布日期 |
1999.03.20 |
申请号 |
KR19920007997 |
申请日期 |
1992.05.12 |
申请人 |
SUMITOMO BAKELITE COMPANY LTD;HURUKAWA CIRCUIT FOIL CO.,LTD |
发明人 |
KATOH, KIMIKAZU;AZUMA, KEIJI;OGURO, RYOICHI |
分类号 |
B29C43/18;B29C33/68;B29C43/20;B29C43/32;B29K105/08;B29L9/00;B29L31/34;B32B15/08;H05K1/03;H05K3/02;(IPC1-7):B32B15/08 |
主分类号 |
B29C43/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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