| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing unit which can prevent a substrate from lifting. SOLUTION: A wafer W is clamped by a clamping claw 24. The clamping claw 24 has a chuck face 142, with which the wafer W comes into contact when clamped. When the wafer W is in a condition of being clamped, the chuck face 142 is inclined to the direction of the center of the wafer W as extending to the upper end side thereof, i.e., the chuck face 142 is inclined from beneath the wafer W to above the wafer W at a given angle of inclination. Thus, the lifting of the wafer W is controlled. |
