发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To easily avoid the electrostatic breakdown, by providing a support board for supporting terminal conductors, making the support board of a resistive material having a lower resistivity than that of air, and specifying the resistance value of the support board between the terminal conductors. SOLUTION: A light emitting diode 1a has a light emitting diode chip 2 as a semiconductor chip, rod-like metal leads 3, 4 as a first and a second terminal conductors and light-permeable resin seal 5, first and second thin metal lead wires 14, 15, and a resistive support board 17 as an envelope. The support board 17 has a low conductivity, resistance of 50 kΩ-50 MΩ between the leads 3, 4 and a resistivity less than that of the air and seal 5. This prevents a high energy from breaking the diode chip 2 and protects it from the electrostatic charge.
申请公布号 JPH1167966(A) 申请公布日期 1999.03.09
申请号 JP19970240469 申请日期 1997.08.20
申请人 SANKEN ELECTRIC CO LTD 发明人 SANO TAKESHI
分类号 H01L23/12;H01L33/32;H01L33/56;H01L33/62 主分类号 H01L23/12
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