| 摘要 |
The semiconductor package for improving the efficiency of spreading heat and the capability of electrical function is disclosed. A semiconductor die is attached on the BT substrate by using a conventional die attaching material. The die is electrically coupled to conductive traces on the top surface of the substrate by the bonding wires, a TAB method or a flip chip method. A plurality of conductive vias are also need for electrically coupling conductive traces on the top surface of the substrate to those on the bottom. At an end portion of each conductive trace on the bottom of the substrate is an conductive pad for connecting to a solder ball for transferring electrical signal. A heatspreader is exactly set over the semiconductor die for improve the efficiency of spreading heat. Additionally, the heatspreader is connected on the ground land of the substrate via a conductive adhesives to form a ground plane. The transmission lines either set between the heatspreader and another ground plane at the bottom of the substrate or set one the same side of two ground planes are served as a strip line structure or a mircostrip line structure, respectively. Therefore, the induction of package itself will be improved and the clock speed of package device will be increased.
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