发明名称 SUBSTRATE HOLDING STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To make it possible to end a film at the end parts of a substrate, at the time of forming the film on the surface of the board, by providing a contact preventing part for preventing a part from coming in touch with the end parts of the substrate. SOLUTION: A contact preventing part 214 is provided in the boundary part between a substrate mount part 211 and a substrate guiding part 212. This contact preventing part 214 prevents a part from coming into contact with the end parts of a substrate 22 by a groove (a) formed along the periphery of the substrate 22 put on a substrate mount part 211. The outside diameter of the groove (a) is set so as to be a size larger than that of the substrate 22, and its inside diameter is set so as to be a size smaller. Consequently, the end parts of the substrate 22 put on the substrate mount part 211 protrude from the substrate mount part 211, and do not touch a substrate mount table 21. So, a film 23 to be formed on the surface of the substrate 22 and a film 23 to be formed on the surfaces of the substrate guiding part 212 and a radiating part 213 are not formed as a continuous film. Namely, the film 23 formed on the surface of the substrate 22 ends at their end parts.</p>
申请公布号 JPH1140654(A) 申请公布日期 1999.02.12
申请号 JP19970192753 申请日期 1997.07.17
申请人 KOKUSAI ELECTRIC CO LTD 发明人 NOMURA SHINICHI
分类号 H01L21/683;H01L21/205;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/683
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