| 摘要 |
<p>PROBLEM TO BE SOLVED: To increase the number of wafers processed at a time to improved the throughput, by providing a claw on which a wafer is placed on the upper surface of holder plates bonded, in multiple stages, in horizontal attitude to a plurality of pillars, while providing a recessed part where a tweezer for wafer shift/place is allowed for free engagement. SOLUTION: A boat comprises such configuration where a plurality of pillars are elected spanning a bottom plate and a top plate, while annular quartz holder plates 40 are welded, in multiple stages, in horizontal attitude to the pillar. On the upper surface of the holder plate 40, one claw 42 is bonded on a center line of the holder plate 40, on the side opposite to wafer taking in/out side, while two claws at laterally symmetric positions about the center line, respectively, three in all. On both sides of the claw 42 on the center line on the upper surface of the holder plate 40, first recessed parts 45 a are formed, respectively, while a second recessed part 46 formed on wafer taking in/out side on the upper surface of the holder plate 40. A tweezer 12 is allowed free engagement with the first recessed parts 45 and the second recessed part 46.</p> |
