| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the thermal strain of a semiconductor chip mounted on an island part to the corners and to prevent a break in an aluminum wiring (aluminum slide) on the surface of the semiconductor chip. SOLUTION: An expansion region (island expansion part 13) of about 2 mm square is made on each corner (four corners) of the island 12 of a lead frame 10. A semiconductor chip 11 is mounted on the island 12 and is electrically connected to a lead frame stitch 15 by a gold wire 16, and then the gold wire 16, the semiconductor chip 11, the island expansion part 13, and a part of lead frame stitch 15 are sealed by resin to constitute a semiconductor device.</p> |
