| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost and suppress the warpage of a substrate by providing electrode pads at central parts of a semiconductor chip and connection pads at corresponding positions on the front and back sides of the chip to the chip electrode pads. SOLUTION: A semiconductor chip 1 comprises electrode pads disposed only at its central parts, permitting wirings to be routed in any the vertical and horizontal direction of the pads. A substrate 3 mounts the chips 1 on the front and back sides and comprises connection pads, disposed at corresponding positions on the front back sides to the chip 1 electrode pads and through-holes piercing the front and back surfaces and outer terminal pads 6. Terminals common to pads 4 on the front and back sides are electrically connected by wiring via through-holes 5, e.g. The through-holes, 5 are through-holes or via holes, for example. |
