| 摘要 |
PROBLEM TO BE SOLVED: To reduce working hours by dividing a region facing a semiconductor pellet on a wiring board into a plurality of regions and arranging the bonding resin in different states in respective regions. SOLUTION: A region facing a semiconductor pellet 1 on a wiring board 4 is divided into a plurality of concentric rectangular regions and the central region thereof is subjected to prior application of liquid epoxy resin and the surface thereof is dried to bring it into a semi-hardened state. Then, a resin 9 with fluidity is applied to the periphery of the resin 8 in the semi-hardened state so that the resin 9 is lower than the resin 8. Then, when the pellet 1 is brought near to the wiring board 4 in parallel with it after a bump electrode 3 and a pad electrode 6 are aligned to be superposed, the bottom surface of the pellet 1 is bonded to the top part of the resin 8. At that time, because the resin 8 is in the semi-hardened state, if it is pressed its peripheral wall expands outwardly but its position is not shifted. Further, part of the bottom surface of the pellet 1 is brought into contact with the resin 9 but it is held by the resin 8, so that the misalignment of the electrodes 3, 6 is prevented. Thus, the semiconductor pellet can be temporarily fixed on the wiring board while preventing the misalignment. |
