| 摘要 |
PROBLEM TO BE SOLVED: To eliminate unevenness in processing of a polishing table and a wafer carrier during of chemical mechanical polishing(CMP) by a method wherein a second sheet form member having a surface opposite to the surface to be polished of a substrate to be processed is arranged on the uneven surface of a first sheet-form member having elasticity and unevenness on the surface thereof. SOLUTION: A polishing pad 10 consists of a sheet on the lower layer side 11 (the side arranged on the polishing table of a CMP device) and a sheet on the upper layer side 12 (the side making contact with a semiconductor wafer). The sheet 11 on the lower layer side is formed of resin having elasticity and has a protrusion part 11a and a recessed part 11b. This constitution performs uniform polishing since, during CMP, the protrusion part 11a is crushed or bent according to the surface shape of a polishing table 13 as a result of the polishing pad 10 being pressed. Further, since restoration against crushing and bending is rapid to make, following the shape change of a polishing table is practicable, and in-plane uniformity of CMP is practicable. |
