| 摘要 |
PROBLEM TO BE SOLVED: To increase the peeling resistance by mixing a Cu plated circuit pattern of a Cu plating layer on an outer layer with a Cu foil circuit pattern having a Cu plating on the Cu foil surface. SOLUTION: On both sides of a laminate board 10 having core layers 12, 14 are formed one-side Cu liquid laminate boards 30 to form Cu plated layers 56 on both sides. The layers 56, pads 50 underlying them, and Cu foils 32 which form conformal masks 52 are photoetched to form outer layer circuit patterns 60, 62. The circuit pattern 62 is a Cu plated one and the other is a Cu foil one. At the Cu foil circuit pattern 62 the Cu foils 32 are tightly adhered to an insulation board 30 to thereby enhance the peeling resistance of the pattern 62. |
