SUBSTRATE COOLING APPARATUS

摘要

A substrate cooling apparatus is provided with a cooling plate disposed in a treating chamber and Peltier elements for supporting and cooling a substrate. A target temperature setter is operable to set a target temperature to which the substrate is to be cooled and a drive device drives the Peltier elements to cool the cooling plate below the target temperature. When the substrate is found to have reached the target temperature, the substrate is raised to a position free from the thermal influence of the cooling plate, to complete a cooling treatment. Consequently, the substrate is cooled at high speed to achieve a reduced cooling time. Where predetermined process modules are used, processing efficiency is improved with a reduced number of substrate cooling elements.