THICKNESS MEASURING METHOD OF SEMICONDUCTOR THIN FILM,申请号JP19970119740-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	THICKNESS MEASURING METHOD OF SEMICONDUCTOR THIN FILM
摘要
申请公布号	JPH10313030(A)	申请公布日期	1998.11.24
申请号	JP19970119740	申请日期	1997.05.09
申请人	SONY CORP	发明人	INAKANAKA HIROSHI
分类号	H01L21/66;(IPC1-7):H01L21/66	主分类号	H01L21/66
代理机构		代理人
主权项
地址

您可能感兴趣的专利

ELECTRONIC CLINICAL THERMOMETER

CONNECTION STRUCTURE OF PISTON AND CONNECTING ROD

FOUR-CYCLE CHAMBER

ENERGY INTAKE DEVICE INWHICH ROTOR TREADS THE GROUND

VARIABLE COMPRESSION RATIO ENGINE

DOUBLE PIPE STRUCTURE AND EXHAUST PIPE STRUCTURE OF INTERNAL COMBUSTION ENGINE

CONTROL DEVICE OF VARIABLE CAPACITY TORQUE CONVERTER FOR VEHICLE

SUCTION AND EXHAUST VALVE DRIVING SYSTEM OF INTERNAL COMBUSTION ENGINE

UREA TEMPERATURE MEASURING DEVICE

LENO CLOTH FOR PATCHING AND REINFORCING, AND COMPOSITE MATERIAL

MAGNESIUM ALLOY COATING FILM AND METHOD FOR PRODUCING THE SAME

DIENE POLYMER AND METHOD FOR PRODUCING THE SAME

POLYESTER, POLYESTER FIBER AND POLYESTER FIBER PRODUCT

BIAXIAL ORIENTATION ACRYLIC RESIN FILM

ALC PANEL FOR FORMING FIREPROOF COATED STRUCTURE, AND FIREPROOF COATED STRUCTURE