Heat transfer member for semiconductor element

摘要

A heat transfer member has a heat transfer unit (30) mounted on a mounting sheet (20). The heat transfer unit (30) comprises a plurality of layers (10) of wire mesh laminated and bonded together and to the mounting sheet (20). The spaces between the wires of the mesh layers (10) of the heat transfer unit (30) permit liquid to pass through the heat transfer unit (30) and so conduct heat away. A semiconductor element (IC chip) (50) is mounted on the mounting sheet (20), and to a base (10). The resulting assembly is immersed in a liquid. Preferably, the planes of the mesh layers (10) are generally perpendicular to the mounting sheet (20) and the semiconductor element (50) and the material of the mounting sheet (20) chosen to have a thermal expansion coefficient between that of the semiconductor element (50) and the heat transfer unit (30) to reduce thermal stresses. The wires of the mesh layers (10) are preferably of copper as this is inexpensive and provides satisfactory heat conduction.