| 摘要 |
PROBLEM TO BE SOLVED: To realize miniaturization, improve package power and increase light emitting amount, by sharing an island part of a lead frame for a light emitting element and a control circuit. SOLUTION: A lead frame 9 made of metal is constituted of an island 4 for sticking a chip like an LED 2 and a lead terminal 6 for external connection. The LED 2 and a monolithic LSI 3 can be mounted on the same island 4 by connecting the cathode of the LED 2 with a reference potential and using, e.g. an N-substrate for the LED 2 and using a P-substrate for the monolithic LSI 3. The monolithic LSI 3 controls the light emitting amount of the LED 2 by adjusting the current amount flowing in the LED 2. The LED 2 and the monolithic LSI 3 are sealed in a package 5 made of resin. In the above constitution, heat generated by light emission is absorbed by the lead frame and dissipated in the air from the lead frame via the package. |
