| 摘要 |
Disclosed is a method of manufacturing bare chip mounting multi-layer printed circuit board in which arbitrary numbers of wiring circuit conductor layers and insulating layers are alternately stacked on one or both surfaces of a printed circuit board as a substrate, and a recessed portion with an upper opening capable of mounting and resin-encapsulating a bare chip part is formed on the surface of the printed circuit board, wherein at least the uppermost one of the insulating layers is made from a photosensitive resin, and the bare chip part mounting recessed portion is formed by photoetching the insulating layer made from the photosensitive resin. Since the bare chip part mounting recessed portion is formed by photoetching, the recessed portion can be easily and reliably formed. This results in a high product accuracy and allows a packaged part to be freely, additionally mounted even on the recessed portion. |
