发明名称 Base layer structure for covering hole in semiconductor insulation layer
摘要 The base layer structure formed in a hole (3a) in a semiconductor insulation layer (3-2) has a base layer (51) extending over at least part of the upper section of the hole and the adjacent part of the insulation layer. The effective thickness of the base layer extending over the upper section of the hole is greater than the thickness of the base layer over the insulation film and greater than a critical thickness so that part of the base layer remains over the upper section of the hole after anisotropic etching for removing the part of the base layer extending over the insulation layer.
申请公布号 DE19817558(A1) 申请公布日期 1998.10.22
申请号 DE1998117558 申请日期 1998.04.20
申请人 NEC CORP., TOKIO/TOKYO, JP 发明人 KIKUTA, KUNIKO, TOKIO/TOKYO, JP
分类号 H01L21/28;H01L21/3205;H01L21/768;H01L23/52;H01L23/522;H01L23/532;(IPC1-7):H01L21/283 主分类号 H01L21/28
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