| 摘要 |
PROBLEM TO BE SOLVED: To prevent the condition of an integrated circuit having elements formed at semiconductor devices from being observed by optical means, by forming steps of specified size with fine grains on the surface of a protective film. SOLUTION: A protective film 14 has a mean surface roughness of 2μm or more with fine grains 14a on the surface. The fine structure of a semiconductor chip on a micron or submicron order can be usually observer, through a microscope using the visible or infrared ray. If the protective film 14 laid on a passivation film 13 has a surface roughness of 2μm or more larger than the observation light wavelength and is transparent, the structure beneath this film 13 is hardly observed because of the optical path greatly bent due to the light refraction or reflection of the film 14. From the view of the observation obstruction, the film 14 and esp. the fine grain 14 is more pref. to be opaque.
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