| 摘要 |
A novel method is disclosed for the removal of organic material, particularly hardened photoresist, from the surface of a substrate. Layers of organic material are removed using at least two treatment cycles, each of which includes the steps of a) applying an acid-containing composition, optionally mixed with an oxidizer, to the substrate surface, and then b) applying water to the substrate surface. The process is characterized by higher temperatures spikes, shorter process times and lower chemical usage than is obtained with conventional photoresist stripping methods which do not employ repetitious treatments. The method may be practised with spray processing equipment. |
