发明名称 |
Dynamic feedback electrostatic wafer chuck |
摘要 |
An electrostatic chuck system having an electrostatic chuck for securely holding a wafer on a surface of the electrostatic chuck. The electrostatic chuck system comprises a wafer bias sensor coupled to a first portion of the electrostatic chuck for sensing an alternating current signal at the first portion. The wafer bias sensor outputs, responsive to the alternating current signal, a direct current voltage level representative of a direct current bias level of the wafer. The electrostatic chuck system further comprises a variable electrostatic chuck power supply coupled to the wafer bias sensor. The variable electrostatic chuck power supply provides a first potential level to the first portion of the electrostatic chuck. The first potential level is modified, responsive to the direct current voltage level, to substantially maintain a first predefined potential difference between the first portion of the electrostatic chuck and a first region of the wafer overlaying the first portion irrespective of a magnitude of the direct current bias level of the wafer.
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申请公布号 |
US5812361(A) |
申请公布日期 |
1998.09.22 |
申请号 |
US19960624988 |
申请日期 |
1996.03.29 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
JONES, PHILLIP LAWRENCE;JAFARIAN-TEHRANI, SEYED JAFAR;ATLAS, BORIS V.;LIU, DAVID R-CHEN;TOKUNAGA, KEN EDWARD;CHEN, CHING-HWA |
分类号 |
B25J15/06;H01L21/683;H02N13/00;(IPC1-7):H02N13/00 |
主分类号 |
B25J15/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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