| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent break of a movable part and invasion of foreign articles to a cavity part, etc., thereby improving a dicing yield by filling, before carrying out dicing, a fixing material protecting the periphery of the movable part in a pressure-reduced state. SOLUTION: A semiconductor substrate wafer l finishing a wafer process and a glass base wafer 7 are bonded by anodic bonding thereby forming a composite wafer. Tone composite wafer is soaked in a liquid of fixing material of high viscosity, e.g., resist 9 in a pressure-reduced state, so that a cavity part 5 is filled via gap parts 2, 6. When the soaking is executed under a reduced pressure, the resist 9 is filled considerably effectively in the cavity part 5. The resist 9 after filled is dried while one primary face of a semiconductor substrate 1a is turned down, that is, the gap part 2 is set lower to the cavity part 5. Thereafter, the composite wafer is diced with the use of a dicing saw or the like and separated to a semiconductor capacitive acceleration sensor chip.</p> |
