| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve a fixed structure of the input/output terminals of a power semiconductor device. SOLUTION: This device is provided with a metallic base 1, metallic patterns 7 insulated on the metallic base 1, a power semiconductor chip 3 mounted on the metallic pattern 7, a plurality of input/output terminals 4 fixed on the metallic patterns with soldering and a resin case 2 fixed on the metallic base 1 by an adhesive. In such a case, a resin cover 5 fixed to the resin case 2 by the adhesive is provided, and the resin cover 5 is provided with input/output terminal holes 10, making the plurality of terminals pass through.</p> |
