| 摘要 |
<p>PROBLEM TO BE SOLVED: To punch an insulating adhesive tape with satisfactory productivity and to closely adhere it to the prescribed part of a lead frame without the sticking out of adhesive by cooling the insulating adhesive tape before punching, dropping a temperature, punching the tape in a prescribed form and adhering it to the desired part containing an inner lead. SOLUTION: The insulating adhesive tape is punched from the material insulating adhesive tape 8 and it is adhered to the inner lead of the lead frame so as to adhere it. Prior to it, the material insulating adhesive tape 8 is loaded on a reel 11 provided in a cooling container 10. The nitrogen of coolant gas is injected from a cooling device 12 and it is cooled under dry atmosphere. The cooled material insulating adhesive tape 8 is punched in the prescribed form by pressing it by a stripper 16 with the punch 14 of a tape punching metallic mold 13 and a die 15. Consequently, viscosity is eliminated from adhesive fitted to the material insulating adhesive tape 8 and the tape is punched in the same body without the sticking out of adhesive from the punching cut end face of the base tape when the tape is punched in the prescribed form.</p> |
