Lead frame, for subsequent chip mounting and bonding to chip housing
摘要
<p>The metallic lead frame (1) is coated on one or both sides with a polymeric adhesion promoter (2). Preferably, the polymer is applied by electrodeposition and has openings (3) at contact faces (4) of the lead frame body (1). Also claimed is a mounting preparation process for the above lead frame.</p>
申请公布号
DE19704351(A1)
申请公布日期
1998.08.06
申请号
DE1997104351
申请日期
1997.02.05
申请人
SIEMENS AG, 80333 MUENCHEN, DE
发明人
THIES, JANCZEK, 93055 REGENSBURG, DE;NEU, ACHIM, 93059 REGENSBURG, DE
