发明名称 ELECTROSTATIC CLOSE CONTACT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electrostatic close contact device, with which bound bubbles become fewer than those developing in the electrostatic close contact device with a conventional technique. SOLUTION: This electrostatic close contacting device is so constituted so to closely contact a sheet 3 extruded from a slot die 2 having at least one electrode 4, which is arranged parallel and near to the surface of a take-up roll 1. In this case, in addition to at least one electrode 4, one more electrode 5 is arranged apart from the surface of the take-up roll 1 so as to apply voltage, which is the same of different one applied to the electrode 4, to the electrode 5 in order to add an electric field more to the electric field developed with the electrode 4.
申请公布号 JPH10193440(A) 申请公布日期 1998.07.28
申请号 JP19970365230 申请日期 1997.12.19
申请人 HOECHST DIAFOIL GMBH 发明人 ZIMMERMANN UWE;MUELLER HARALD;WACKER DETLEF
分类号 B29C47/88;B29L7/00 主分类号 B29C47/88
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