发明名称 Method of making antifuse structures using implantation of both neutral and dopant species
摘要 An antifuse structure includes a first electrode, a layer of enhanced amorphous silicon over the first electrode, and a second electrode over the layer of enhanced amorphous silicon. The layer of enhanced amorphous silicon is formed by an ion-implantation of a neutral species and a dopant species into a deposited layer of amorphous silicon, such that the antifuse structure will have a stable conductive link in a programmed state and such that it will be less susceptible to off-state leakage in an unprogrammed state. A method for making an antifuse structure includes forming a lower electrode, depositing an amorphous silicon layer over the lower electrode, ion-implanting a neutral species and a dopant species into the amorphous silicon layer, and forming an upper electrode over the amorphous silicon layer.
申请公布号 US5783467(A) 申请公布日期 1998.07.21
申请号 US19950582844 申请日期 1995.12.29
申请人 VLSI TECHNOLOGY, INC. 发明人 HAN, YU-PIN;LOH, YING-TSONG;SANCHEZ, IVAN
分类号 H01L21/8246;H01L27/112;(IPC1-7):H01L21/82 主分类号 H01L21/8246
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