| 发明名称 |
GURTBAND ZUM BEREITSTELLEN VON LOTDEPOTS ZUM AUFLÖTEN VON BAUELEMENTEN AUF EINE LEITERPLATTE |
| 摘要 |
<p>The carrier belt (1) is made of a material resistant to solder, and is provided with holes for spherical solder portions (2) which on both sides protrude from the belt, while the location of the solder portions corresp. to the position of connections of the components to be soldered onto a circuit board. The belt is characterised by the fact that the tops of the solder portions are pressed flat without, however, eliminating their protrusion.</p> |
| 申请公布号 |
AT167978(T) |
申请公布日期 |
1998.07.15 |
| 申请号 |
AT19950103515T |
申请日期 |
1995.03.10 |
| 申请人 |
MAYER, HEINRICH;MERKENSCHLAGER, HANS-HERMANN |
发明人 |
MAYER, HEINRICH, DIPL.-ING.(FH);KOCH, VOLKER-EKKEHART, DR.RER.NAT.;MERKENSCHLAGER, HANS-HERMANN, DIPL.-IN |
| 分类号 |
B23K35/02;H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
B23K35/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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