| 摘要 |
<p>An electronic package is provided wherein a semiconductor device on a substrate is encapsulated with a thermally reworkable encapsulant composition comprising: (a) a thermally reworkable cross-linked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one filler present from 25 to 75 percent by weight based upon the amount of components (a) and (b). Such a process provides a readily reworkable electronic package.</p> |
