| 发明名称 |
Very dense integrated circuit package |
| 摘要 |
Disclosed is an integrated circuit configuration including a carrier having recesses for supporting individual semiconductor die units. The semiconductor die units and the carrier recesses have lithographically defined dimensions so as to enable precise alignment and a high level of integration. |
| 申请公布号 |
US5770884(A) |
申请公布日期 |
1998.06.23 |
| 申请号 |
US19950497498 |
申请日期 |
1995.06.30 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
POGGE, H. BERNHARD;GRESCHNER, JOHANN;KALTER, HOWARD LEO;ROSNER, RAYMOND JAMES |
| 分类号 |
H01L21/28;H01L21/301;H01L21/98;H01L25/065;H01L29/06;(IPC1-7):H01L23/48;H01L23/52 |
主分类号 |
H01L21/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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