Two-part metallic heat sink manufacturing method for semiconductor device

摘要

The method involves forming bodies or strings of aluminium alloy with one or more cavities. One part (1) is of L-section with one wall (11) for contact with the semiconductor, extending at right angles to the other wall (12) and having cooling fins (13) on the inside. Small beads (111,121) at the ends of the respective walls define adjacent grooves (112,122). Two such parts can be assembled back-to-back for a simple heat sink. Alternatively a Z-section second part with fins (24,25) on both sides of a wall (21), and beads (211,221,231,233) and grooves (212,222,232,234) at both ends, may be interposed. Two or more such Z-sections between two L-sections can provide multiple cavities.