发明名称 USE OF A SOUND ABSORBING SUBSTRATE AS AN UNDERLAYER IN A FLOORING STRUCTURE
摘要 <p>A sound absorbing substrate (10) is used as an underlayer in a flooring structure (1) including a subfloor (3) and a top floor (5). The substrate (10) is made of a resilient material and more particularly of recycled tires. It comprises a bottom surface (12) provided with cavities (16) in the form of grooves that are V- or U-shaped and preferably extend at an angle of about 45° with respect to one side edge of the substrate. These cavities leave a portion of the bottom surface in contact with the subfloor. The surface ratio of the portion of bottom surface of the substrate in contact with the subfloor to the surface of this subfloor ranges from 20 to 65 %. Such a substrate (10) can be of reduced thickness while still having good sound absorbing properties.</p>
申请公布号 WO1998021027(A1) 申请公布日期 1998.05.22
申请号 CA1997000836 申请日期 1997.11.04
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