BUMP BONDER

摘要

PROBLEM TO BE SOLVED: To provide a bump bonder which can form a good bump by using defective balls as extra bonding by slightly suppressing the deterioration of the bump forming tact efficiency. SOLUTION: A chip 19 for extra bonding is arranged near specific positions on a bonding stage 17 on which semiconductor chips 13a and 13b are respectively held at the specific positions for forming bumps and the extra bonding is executed on the chip 19. When the chip 19 is positioned in such a way, the extra bonding can be performed without moving a capillary from the stage 17 providing a working place for a large distance.