The invention concerns a method of producing a MOS transistor with a heavily doped drain (HDD) profile and a lightly-doped drain (LDD) profile. According to this method, in order to produce steep doping substance profiles in the region of the LDD profile, the HDD profile is formed first and then the LDD profile is formed. The LDD profile is preferably produced by etching and selective epitaxy which is doped in situ.