A CYLINDRICAL CARRIAGE SPUTTERING SYSTEM

摘要

A cylindrical carriage sputtering system for disk, wafer, and flat panel substrates comprising a cylindrical shaped vacuum sealed passageway formed by two concentric inner and outer hollow cylinders, along with a top and a bottom sealing flange. A central hollow cylinder, disposed between the inner and outer cylinders, includes substrate-carrying openings and serves as a cylindrical carriage which substantially fills the sealed passageway and is rotatable in predetermined steps. Novel substrate processing devices for deposition, heating, and cooling are attached around the circumference of the inner and outer cylindrical walls. Vacuum pumps are located between substrate processing devices. The openings in the cylindrical carriage are each fitted with thermally isolated substrate holders for supporting a multiplicity of substrates. Unique entrance and exit vacuum load-locks with integrated robotic means are provided for transferring disk substrates into and out of the system. The sputtering system is designed to allow the processing of substrates at temperatures of up to about 1000 DEG C in either stationary or pass-through sputtering modes.